Na'urar Haɗin Waya
-
Semiconductor IC Bonding Equipment/Aluminum Wedge Bonding Machine GR-W01
Don Sabbin batirin wutar lantarki, masu juyawa na hotovoltaic, kayan lantarki na mota, ajiyar makamashi, IGBT, allon kula da amincin baturi na BMS, da sauransu;
Wannan na'ura mai haɗa waya zai iya dacewa da aluminum da kuma haɗin waya na jan karfe;
-
Aluminum Wire Bonding Machine don TO Series Wire bonding -Wedge bonding ICs/GR-W02
Na'urar haɗa waya ta musamman;
GR-W02 shine na'ura mai haɗawa da waya wanda ya dace da na'urorin wutar lantarki, samfurin ya dace da jere guda zuwa Multi-jere ultrasonic marufi da ƙira, ana amfani da bonder bayan babban adadin abubuwan haɓakawa, ta amfani da ingantattun ingantattun ingantattun injunan layi, injin muryoyin muryoyin murya, tsarin ultrasonic don samarwa. Bugu da kari, daɗaɗɗen ƙwarewar ƙirar ƙirar na'urar tana ba da ingantaccen aiki da dogaro da masana'antu.
