Semiconductor IC Bonding Equipment/Aluminum Wedge Bonding Machine GR-W01

Don Sabbin batirin wutar lantarki, masu juyawa na hotovoltaic, na'urorin lantarki na mota, ajiyar makamashi, IGBT, allon kula da amincin baturi na BMS, da sauransu;

Wannan na'ura mai haɗa waya zai iya dacewa da aluminum da kuma haɗin waya na jan karfe;

Aika mana imel

Cikakken Bayani

Tags samfurin

Siffar Samfurin

● Haɗa igiyoyi masu kauri da ɗigon ruwa a cikin dandamali ɗaya na injin tare da saurin canjin tsarin;
●Ta hanyar jadadda mallaka waldi tsari iko, da waldi sigogi za a iya gyara a cikin ainihin lokaci ga canji abu surface don tabbatar da repeatable waldi quality;
●Tsarin nuna gaskiya ta hanyar haɗin kai maras kyau dangane da ka'idojin masana'antu 4.0 / OT;
● Samun mafi kyawun kayan da ya dace ta hanyar nau'i-nau'i na ultrasonic da yawa don zaɓar daga, da kuma inganta zaman lafiyar tsarin;
●Haɗuwa da fasaha na tsari da kuma aiki da kai daga tushen wadata guda ɗaya.