Aikace-aikace a Masana'antar Semiconductor
GREEN Babban Kasuwancin Fasaha ne na ƙasa wanda aka keɓe don R&D da kera na'urorin lantarki mai sarrafa kansa da fakitin semiconductor & kayan gwaji. Yin hidima ga shugabannin masana'antu irin su BYD, Foxconn, TDK, SMIC, Canadian Solar, Midea, da 20+ sauran kamfanoni na Fortune Global 500. Abokin haɗin gwiwar ku amintaccen don samar da ingantattun hanyoyin masana'antu.
Na'urorin haɗin gwiwa suna ba da damar ƙananan haɗin haɗin gwiwa tare da diamita na waya, tabbatar da amincin sigina; formic acid Vacuum soldering form abin dogara gidajen abinci a karkashin oxygen abun ciki <10ppm, hana hadawan abu da iskar shaka gazawar a high-yawa marufi; AOI yana katse lahanin matakan ƙananan ƙananan. Wannan haɗin gwiwar yana tabbatar da> 99.95% ci-gaba yawan yawan marufi, saduwa da matsananciyar buƙatun gwaji na kwakwalwan kwamfuta na 5G/AI.
Ultrasonic Wire Bonder
Mai iya haɗawa 100 μm-500 μm aluminum waya, 200 μm-500 μm jan karfe waya, aluminum ribbons har zuwa 2000 μm fadi da 300 μm kauri, kazalika da jan karfe ribbons.
Kewayon balaguro: 300 mm × 300 mm, 300 mm × 800 mm (wanda za a iya canzawa), tare da maimaitawa <± 3 μm
Kewayon tafiya: 100 mm × 100 mm, tare da maimaitawa <± 3 μm
Menene Fasahar Haɗin Waya?
Haɗin waya dabara ce ta haɗin haɗin gwiwar microelectronic da ake amfani da ita don haɗa na'urorin semiconductor zuwa marufi ko kayan aikin su. A matsayin ɗayan mafi mahimmancin fasaha a cikin masana'antar semiconductor, yana ba da damar yin hulɗar guntu tare da da'irori na waje a cikin na'urorin lantarki.
Kayayyakin Waya Daɗi
1. Aluminum (Aluminum)
Ƙarfin wutar lantarki vs. zinari, mai tsada
2. Copper (Cu)
25% mafi girman ƙarfin wutar lantarki/ thermal fiye da Au
3. Zinariya (Au)
Mafi kyawun halayen halayen, juriya na lalata, da amincin haɗin gwiwa
4. Azurfa (Ag)
Mafi girman ƙarfin aiki tsakanin karafa
Aluminum Waya
Aluminum Ribbon
Waya Copper
Copper Ribbon
Semiconductor Die Bonding & Wire Bonding AOI
Yana amfani da kyamarar masana'antu 25-megapixel don gano haɗe-haɗen mutu da lahani na haɗin waya akan samfuran kamar ICs, IGBTs, MOSFETs, da firam ɗin jagora, cimma ƙimar gano lahani fiye da 99.9%.
Abubuwan dubawa
Mai ikon bincika tsayin guntu da faɗuwa, guntu diyya, karkata, da guntuwa; solder ball ba mannewa da solder hadin gwiwa detachment; Lalacewar haɗin waya da suka haɗa da tsayin madauki mai wuce kima ko rashin isa, rugujewar madauki, fashewar wayoyi, wayoyi da suka ɓace, lambar waya, lankwasa waya, tsallake madauki, da tsayin wutsiya mai yawa; rashin isasshen m; da karfe splatter.
Solder Ball / Rago
Chip Scratch
Wurin Chip, Girma, Ƙaƙwalwar Abinci
Gurɓatar Chip/Kayan Waje
Chipping
Ceramic Trench Cracks
Gurbacewar yumbu Trench
AMB Oxidation
In-Line Formic Acid Reflow Tanda
1. Matsakaicin zafin jiki ≥ 450 ° C, mafi ƙarancin matakin injin <5 Pa
2. Goyan bayan formic acid da nitrogen tsarin yanayi
3. Matsakaicin banza guda ɗaya ≦ 1%, ƙimar banza gabaɗaya ≦ 2%
4. Ruwa mai sanyaya + sanyaya nitrogen, sanye take da tsarin sanyaya ruwa da sanyaya lamba
IGBT Power Semiconductor
Matsakaicin ƙimar ɓarna a cikin siyarwar IGBT na iya haifar da gazawar sarkar da ta haɗa da guduwar zafi, fashewar inji, da lalata aikin lantarki. Rage ƙarancin kuɗi zuwa ≤1% yana haɓaka amincin na'urar da ingancin kuzari.
IGBT Production tsarin tafiyar matakai
